Thermal stability of alkanethiolate and aromatic thiolate self-assembled monolayers on Au(111): an X-ray photoelectron spectroscopy study
Applications of functional self-assembled monolayers (SAMs) rely to a large extent on their stability, with the thermal stability being of particular importance. In this context, thermal stability of archetypical, non-substituted alkanethiolate (AT) and aromatic thiolate (ArT) SAMs on gold was studi...
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| Hauptverfasser: | , , |
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| Dokumenttyp: | Article (Journal) |
| Sprache: | Englisch |
| Veröffentlicht: |
September 28, 2021
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| In: |
The journal of physical chemistry. C, Energy, materials, and catalysis
Year: 2021, Jahrgang: 125, Heft: 39, Pages: 21754-21763 |
| ISSN: | 1932-7455 |
| DOI: | 10.1021/acs.jpcc.1c06984 |
| Online-Zugang: | Verlag, lizenzpflichtig, Volltext: https://doi.org/10.1021/acs.jpcc.1c06984 |
| Verfasserangaben: | Andika Asyuda, Saunak Das, and Michael Zharnikov |
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| 245 | 1 | 0 | |a Thermal stability of alkanethiolate and aromatic thiolate self-assembled monolayers on Au(111) |b an X-ray photoelectron spectroscopy study |c Andika Asyuda, Saunak Das, and Michael Zharnikov |
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| 520 | |a Applications of functional self-assembled monolayers (SAMs) rely to a large extent on their stability, with the thermal stability being of particular importance. In this context, thermal stability of archetypical, non-substituted alkanethiolate (AT) and aromatic thiolate (ArT) SAMs on gold was studied by synchrotron-based high-resolution X-ray photoelectron spectroscopy, taking several monolayers with different lengths of the molecular backbones as representative examples and heating them in UHV. Evaporated, grain-structured Au(111) was used as the support, in view of broad practical relevance of this substrate type. AT and ArT SAMs were found to be stable up to temperatures of ∼373 and ∼383-393 K, respectively, followed by extensive molecular desorption and decomposition upon further heating. The decomposition was mediated by the cleavage of C-S bonds, which represented the so-called “weak or weakest link” in the systems. This process contributed minorly to the temperature-induced degradation of AT SAMs but was the dominant degradation channel for the ArT case. The residual films exhibited ∼10% (AT) or ∼ 35% (ArT) of the initial packing density and represented a superposition of the laying-down phase and atomically adsorbed sulfur, with a possible coexistence of a restructured, standing-up phase in the ArT case. | ||
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