Ahlrichs, P., Riedel, U., & Warnatz, J. (1998). Spatially-averaged model for plasma etch processes: Comparison of different approaches to electron kinetics. Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 16(3), . https://doi.org/10.1116/1.581187
Chicago-Zitierstil (17. Ausg.)Ahlrichs, Patrick, Uwe Riedel, und Jürgen Warnatz. "Spatially-averaged Model for Plasma Etch Processes: Comparison of Different Approaches to Electron Kinetics." Journal of Vacuum Science & Technology. A, Vacuum, Surfaces, and Films 16, no. 3 (1998). https://doi.org/10.1116/1.581187.
MLA-Zitierstil (9. Ausg.)Ahlrichs, Patrick, et al. "Spatially-averaged Model for Plasma Etch Processes: Comparison of Different Approaches to Electron Kinetics." Journal of Vacuum Science & Technology. A, Vacuum, Surfaces, and Films, vol. 16, no. 3, 1998, https://doi.org/10.1116/1.581187.