The effect of PECVD SiNx moisture barrier layers on the degradation of a flip chip underfill material
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| Main Authors: | , |
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| Format: | Article (Journal) |
| Language: | English |
| Published: |
2001
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| In: |
Soldering & surface mount technology
Year: 2001, Volume: 13, Issue: 3, Pages: 12-15 |
| ISSN: | 1758-6836 |
| DOI: | 10.1108/EUM0000000006024 |
| Online Access: | Verlag, kostenfrei registrierungspflichtig, Volltext: https://doi.org/10.1108/EUM0000000006024
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| Author Notes: | G. Kaltenpoth, W. Siebert, X-M. Xie, F. Stubhan |
| Item Description: | Gesehen am 26.03.2018 Der Buchstabe "x" ist im Titel tiefgestellt |
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| Physical Description: | Online Resource |
| ISSN: | 1758-6836 |
| DOI: | 10.1108/EUM0000000006024 |