APA (7th ed.) Citation

Kaltenpoth, G., & Siebert, W. (2001). The effect of PECVD SiNx moisture barrier layers on the degradation of a flip chip underfill material. Soldering & surface mount technology, 13(3), . https://doi.org/10.1108/EUM0000000006024

Chicago Style (17th ed.) Citation

Kaltenpoth, Gisela, and Walter Siebert. "The Effect of PECVD SiNx Moisture Barrier Layers on the Degradation of a Flip Chip Underfill Material." Soldering & Surface Mount Technology 13, no. 3 (2001). https://doi.org/10.1108/EUM0000000006024.

MLA (9th ed.) Citation

Kaltenpoth, Gisela, and Walter Siebert. "The Effect of PECVD SiNx Moisture Barrier Layers on the Degradation of a Flip Chip Underfill Material." Soldering & Surface Mount Technology, vol. 13, no. 3, 2001, https://doi.org/10.1108/EUM0000000006024.