The effect of PECVD SiNx moisture barrier layers on the degradation of a flip chip underfill material
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Dokumenttyp: | Article (Journal) |
| Sprache: | Englisch |
| Veröffentlicht: |
2001
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| In: |
Soldering & surface mount technology
Year: 2001, Jahrgang: 13, Heft: 3, Pages: 12-15 |
| ISSN: | 1758-6836 |
| DOI: | 10.1108/EUM0000000006024 |
| Online-Zugang: | Verlag, kostenfrei registrierungspflichtig, Volltext: https://doi.org/10.1108/EUM0000000006024
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| Verfasserangaben: | G. Kaltenpoth, W. Siebert, X-M. Xie, F. Stubhan |
MARC
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