Anodization-free fabrication process for high-quality cross-type Josephson tunnel junctions based on a Nb/Al-AlOx/Nb trilayer

Josephson tunnel junctions form the basis for various superconductor electronic devices. For this reason, enormous efforts are routinely taken to establish and later on maintain a scalable and reproducible wafer-scale manufacturing process for high-quality Josephson junctions. Here, we present an an...

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Bibliographic Details
Main Authors: Adam, Fabienne (Author) , Enss, Christian (Author) , Kempf, Sebastian (Author)
Format: Article (Journal)
Language:English
Published: 8 July 2024
In: Superconductor science and technology
Year: 2024, Volume: 37, Issue: 8, Pages: 1-12
ISSN:1361-6668
DOI:10.1088/1361-6668/ad59cf
Online Access:Verlag, kostenfrei, Volltext: https://doi.org/10.1088/1361-6668/ad59cf
Verlag, kostenfrei, Volltext: https://dx.doi.org/10.1088/1361-6668/ad59cf
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Author Notes:F Adam, C Enss and S Kempf
Description
Summary:Josephson tunnel junctions form the basis for various superconductor electronic devices. For this reason, enormous efforts are routinely taken to establish and later on maintain a scalable and reproducible wafer-scale manufacturing process for high-quality Josephson junctions. Here, we present an anodization-free fabrication process for Nb/Al-AlO x /Nb cross-type Josephson junctions that requires only a small number of process steps and that is in general intrinsically compatible with wafer-scale fabrication. We show that the fabricated junctions are of very high quality and, compared to other junction types, exhibit not only a significantly reduced capacitance but also an almost rectangular critical current density profile. Our process hence enables the usage of low capacitance Josephson junctions for superconductor electronic devices such as ultra-low noise dc-superconducting quantum interference devices (SQUIDs), microwave SQUID multiplexers based on non-hysteretic rf-SQUIDs and RFSQ circuits.
Item Description:Gesehen am 19.12.2024
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Physical Description:Online Resource
ISSN:1361-6668
DOI:10.1088/1361-6668/ad59cf