Spatially-averaged model for plasma etch processes: Comparison of different approaches to electron kinetics

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Bibliographic Details
Main Authors: Ahlrichs, Patrick (Author) , Riedel, Uwe (Author) , Warnatz, Jürgen (Author)
Format: Article (Journal)
Language:English
Published: [1998]
In: Journal of vacuum science & technology. A, Vacuum, surfaces, and films
Year: 1998, Volume: 16, Issue: 3, Pages: 1560-1565
ISSN:1520-8559
DOI:10.1116/1.581187
Online Access:Verlag, Volltext: http://dx.doi.org/10.1116/1.581187
Verlag, Volltext: http://avs.scitation.org/doi/10.1116/1.581187
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Author Notes:P. Ahlrichs, U. Riedel, and J. Warnatz
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Item Description:Gesehen am 02.10.2017
Physical Description:Online Resource
ISSN:1520-8559
DOI:10.1116/1.581187