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High-Precision combinatorial deposition of micro particle patterns on a microelectronic chip

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The behavior of charged bio polymer micro particles when deposited onto a CMOS chip can be analytically modeled in form of the incompressible Navier-Stokes equation and the electrostatic Poisson equation, as we describe in this article. Based on these models, numerical simulations of depositions can...

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Main Authors: Löffler, Felix (Author) , Wagner, Jennifer (Author) , König, Kai (Author) , Märkle, Frieder (Author) , Fernández, Simón (Author) , Schirwitz, Christopher (Author) , Torralba, Gloria (Author) , Hausmann, Michael (Author) , Lindenstruth, V. (Author) , Bischoff, F. Ralf (Author) , Breitling, F. (Author) , Nesterov, A. (Author)
Format: Article (Journal)
Language:English
Published: 2011
In: Aerosol science and technology
Year: 2011, Volume: 45, Issue: 1, Pages: 65-74
ISSN:1521-7388
DOI:10.1080/02786826.2010.517814
Online Access:Verlag, lizenzpflichtig, Volltext: https://doi.org/10.1080/02786826.2010.517814
Verlag, lizenzpflichtig, Volltext: https://www.tandfonline.com/doi/full/10.1080/02786826.2010.517814
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Author Notes:F. Löffler, J. Wagner, K. König, F. Märkle, S. Fernandez, C. Schirwitz, G. Torralba, M. Hausmann, V. Lindenstruth, F.R. Bischoff, F. Breitling, and A. Nesterov
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Summary:The behavior of charged bio polymer micro particles when deposited onto a CMOS chip can be analytically modeled in form of the incompressible Navier-Stokes equation and the electrostatic Poisson equation, as we describe in this article. Based on these models, numerical simulations of depositions can be implemented in COMSOL that lead to improvements in the experimental setup, optimizing the size and charge distribution of the micro particles. Adapting the experiments according to the simulation results, we will show the powerful gain in deposition precision, which is essential for a contamination-free deposition and hence high quality combinatorial deposition.
Item Description:Gesehen am 20.09.2022
Physical Description:Online Resource
ISSN:1521-7388
DOI:10.1080/02786826.2010.517814

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