Characterisation of the first wafer-scale prototype for the ALICE ITS3 upgrade: the monolithic stitched sensor (MOSS)
This paper presents the characterisation and testing of the first wafer-scale monolithic stitched sensor (MOSS) prototype developed for the ALICE ITS3 upgrade that is to be installed during the LHC Long Shutdown 3 (2026-2030). The MOSS chip design is driven by the truly cylindrical detector geometry...
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| Main Authors: | , , , , |
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| Format: | Article (Journal) |
| Language: | English |
| Published: |
June 2026
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| In: |
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment
Year: 2026, Volume: 1086, Pages: 1-20 |
| ISSN: | 1872-9576 |
| DOI: | 10.1016/j.nima.2026.171297 |
| Online Access: | Verlag, kostenfrei, Volltext: https://doi.org/10.1016/j.nima.2026.171297 Verlag, kostenfrei, Volltext: https://www.sciencedirect.com/science/article/pii/S0168900226000239 
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| Author Notes: | Omar Abdelrahman, Gianluca Aglieri Rinella, Luca Aglietta, Giacomo Alocco, Matias Antonelli, Roberto Baccomi, Francesco Barile, Pascal Becht, Franco Benotto, Stefania Maria Beolè, Marcello Borri, Daniela Bortoletto, Naseem Bouchhar, Giuseppe Eugenio Bruno, Matthew Daniel Buckland, Szymon Bugiel, Paolo Camerini, Francesca Carnesecchi, Marielle Chartier, Domenico Colella, Angelo Colelli, Giacomo Contin, Giuseppe De Robertis, Wenjing Deng, Antonello Di Mauro, Vittorio Di Trapani, Maurice Donner, Ana Dorda Martin, Piotr Dorosz, Floarea Dumitrache, Lars Döpper, Gregor Hieronymus Eberwein, Domenico Elia, Simone Emiliani, Laura Fabbietti, Tommaso Fagotto, Xiaochao Fang, Henrik Fribert, Roman Gernhäuser, Piero Giubilato, Laura Gonella, Karl Gran Grodaas, Ola Slettevoll Groettvik, Vladimir Gromov, Malte Grönbeck, Philip Hauer, Hartmut Hillemanns, Guen Hee Hong, Yu Hu, Minyoung Chris Hwang, Marc Alain Imhoff, Barbara Jacak, Daniel Matthew Jones, Antoine Junique, Filip Křížek, Jetnipit Kaewjai, Anouk Kaiser, Jesper Karlsson Gumprecht, Markus Keil, Bernhard Ketzer, Jiyoung Kim, Lena Kirchner, Kritsada Kittimanapun, Alex Kluge, Chinorat Kobdaj, Artem Kotliarov, Thanushan Kugathasan, Marc König, Paola La Rocca, Natthawut Laojamnongwong, Lukas Lautner, Corentin Lemoine, Long Li, Beatrice Eva Liang-Gilman, Francesco Licciulli, Sanghoon Lim, Bong-Hwi Lim, Jian Liu, Flavio Loddo, Matteo Lupi, Magnus Mager, Philipp Mann, Georgios Mantzaridis, Davide Marras, Paolo Martinengo, Silvia Masciocchi, Annalisa Mastroserio, Soniya Mathew, Serena Mattiazzo, Marius Wilm Menzel, Nicola Minafra, Frederic Morel, Alice Mulliri, Luciano Musa, Anjali Ila Nambrath, Rajendra Nath Patra, Iaroslav Panasenko, Styliani Paniskaki, Caterina Pantouvakis, Cosimo Pastore, Stefania Perciballi, Francesco Piro, Adithya Pulli, Alexander Rachev, Alexander Rachevski, Ivan Ravasenga, Felix Reidt, Michele Rignanese, Giacomo Ripamonti, Isabella Sanna, Valerio Sarritzu, Umberto Savino, Iain Sedgwick, Serhiy Senyukov, Danush Shekar, Sabyasachi Siddhanta, David Silvermyr, Walter Snoeys, Joey Staa, Alessandro Sturniolo, Miljenko Šuljić, Timea Szollosova, Daniel Tapia Takaki, Livia Terlizzi, Nicolas Tiltmann, Antonio Trifirò, Christina Tsolanta, Rosario Turrisi, Berkin Ulukutlu, Gianluca Usai, Isabelle Valin, Giovanni Vecil, Pedro Vicente Leitao, Anna Villani, Chunzheng Wang, Zhenyu Ye, Emma Rose Yeats, Asli Yelkenci, Zijun Zhao, Alessandra Zingaretti |
| Summary: | This paper presents the characterisation and testing of the first wafer-scale monolithic stitched sensor (MOSS) prototype developed for the ALICE ITS3 upgrade that is to be installed during the LHC Long Shutdown 3 (2026-2030). The MOSS chip design is driven by the truly cylindrical detector geometry that imposes that each layer is built out of two wafer-sized, bent silicon chips. The stitching technique is employed to fabricate sensors with dimensions of 1.4 cm × 25.9 cm, thinned to 50 μm. The chip architecture, the in-pixel front-end, the laboratory and in-beam characterisation, the susceptibility to single-event effects, and the series testing are discussed. The testing campaign validates the design of a wafer-scale stitched sensor and the performance of the pixel matrix to be within the ITS3 requirements. The MOSS chip demonstrates the feasibility of the ITS3 detector concept and provides insights for further optimisation and development. |
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| Item Description: | Online verfügbar: 23. Januar 2026, Artikelversion: 30. Januar 2026 Gesehen am 17.04.2026 |
| Physical Description: | Online Resource |
| ISSN: | 1872-9576 |
| DOI: | 10.1016/j.nima.2026.171297 |